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GD660HFA75N5HY_B29
Merry
750V/660A Half Bridge Trench-FS Gen2 IGBT, N5, GD660HFA75N5HY_B29
Package:N5
Rated Current:660A
Chip Type:Trench-FS Gen2
Rated Voltage:750V
Circuit Structure:Half Bridge
Hallmark:Injection Molding,PINFIN Substrates
Features :
- Low VCE(sat) Trench IGBT technology
- Low switching losses
- 6μs short circuit capability
- VCE(sat) with positive temperature coefficient
- Maximum junction temperature 175oC
- Low inductance case
- Fast & soft reverse recovery anti-parallel FWD
- Isolated copper pinfin baseplate using Si3N4 AMB technology
Typical Applications :
- Automotive application
- Hybrid and electric vehicle
- Inverter for motor drive
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Name1
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750V/660A Half Bridge Trench-FS Gen2 IGBT, N5, GD660HFA75N5HY_B29
Package:N5
Rated Current:660A
Chip Type:Trench-FS Gen2
Rated Voltage:750V
Circuit Structure:Half Bridge
Hallmark:Injection Molding,PINFIN Substrates
Features :
- Low VCE(sat) Trench IGBT technology
- Low switching losses
- 6μs short circuit capability
- VCE(sat) with positive temperature coefficient
- Maximum junction temperature 175oC
- Low inductance case
- Fast & soft reverse recovery anti-parallel FWD
- Isolated copper pinfin baseplate using Si3N4 AMB technology
Typical Applications :
- Automotive application
- Hybrid and electric vehicle
- Inverter for motor drive
Name1
Name2
Name1
Name2
Name1
Name2
Name1
Name2