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MUR6060P
Features
High frequency operation
High surge forward current capability
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance
Guard ring for enhanced ruggedness and long term reliability
Solder dip 275 °C max. 7 s, per JESD 22-B106
Typical Applications
Typical applications are in switching power supplies, converters, freewheeling diodes, and reverse battery protection.
Mechanical Data
Package: TO-247AD-2L Molding compound meets UL 94 V-0 flammability rating, RoHS-compliant
Terminals: Tin plated leads, solderable per J-STD002 and JESD22-B102
Polarity: As marked
Features
High frequency operation
High surge forward current capability
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance
Guard ring for enhanced ruggedness and long term reliability
Solder dip 275 °C max. 7 s, per JESD 22-B106
Typical Applications
Typical applications are in switching power supplies, converters, freewheeling diodes, and reverse battery protection.
Mechanical Data
Package: TO-247AD-2L Molding compound meets UL 94 V-0 flammability rating, RoHS-compliant
Terminals: Tin plated leads, solderable per J-STD002 and JESD22-B102
Polarity: As marked